AnnouncedLatest filing 22 July 2025
Temelio Inc.
Temelio Inc. is a New York, NY technology company with 1 venture-backed raise in public filings, $7M sold in all. The latest was filed on 22 July 2025.
Announced on 7 July 2025, 15 days before the filing.
Raises
- Equity round$7M
Investors on the board
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