UnannouncedVCCompany

AnnouncedLatest filing 18 July 2025

BondCliq Inc

BondCliq Inc is a New York, NY technology company with 6 venture-backed raises in public filings, $21.8M sold in all. The latest was filed on 18 July 2025.

Announced on 14 July 2025, 4 days before the filing.

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Raises

  1. Equity round$3MAnnounced18 Jul 2025 · New York, NY
  2. Equity round$621KFiled before 202527 Jun 2024 · New York, NY
  3. Equity round$7.5MFiled before 202511 Jan 2022 · New York, NY
  4. Equity round$6.4MFiled before 202513 Jul 2021 · New York, NY
  5. Debt round$2.21MFiled before 20258 Dec 2020 · New York, NY
  6. Equity round$2.04MFiled before 20256 Jul 2020 · New York, NY

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