AnnouncedFiled 18 July 2025
BondCliq Inc raised $3M
BondCliq Inc, a technology company based in New York, NY, raised $3M in a new equity round, according to a filing dated 18 July 2025.
Announced on 14 July 2025, 4 days before the filing. businesswire.com ↗
- Filed
- 18 July 2025
- Round
- Equity round
- Amount sold
- $3M
- Offering size
- $4.7M
- Investors so far
- 1
- Based in
- New York, NY
- Website
- bondcliq.com
Investors on the board
Firms come from the venture funds whose filings name a director of this company.
Who is on the board
1 director of this company is named on venture funds' filings. Sign in free with Google to see who, the full filing, and a short list of rounds like this each morning.
Sign in with GoogleHow it compares
Larger than 27% of the 1,405 tracked raises with an amount filed in 2025, and than 29% of the 712 in technology.
BondCliq Inc in public filings
| Filed | Filing | Sold | Raise |
|---|---|---|---|
| 18 Jul 2025 | New filing | $3M | This raise |
| 27 Jun 2024 | New filing | $621K | Another raise |
| 11 Jan 2022 | New filing | $7.5M | Another raise |
| 13 Jul 2021 | New filing | $6.4M | Another raise |
| 8 Dec 2020 | New filing | $2.21M | Another raise |
| 6 Jul 2020 | New filing | $2.04M | Another raise |
Other unannounced rounds
- Thoughtform, Inc.$6.6M
- ProvenAir Technologies, Inc.$488K
- Gravitics, Inc.$17M
- SurgiBox Inc.$486K
- Voxel Labs Inc.$10M
- DVx Atomic Co.$18.5M
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