Filed before 2025Latest filing 28 March 2023
Hiya, Inc.
Hiya, Inc. is a Seattle, WA telecommunications company with 3 venture-backed raises in public filings, $30.7M sold in all. The latest was filed on 28 March 2023.
Raises filed before 2025 are not checked for a public announcement.
Raises
- Equity round$4.7M
- Debt round$8.5M
- Equity round$17.5M
Investors on the board
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