Filed before 2025Filed 3 May 2021
Hiya, Inc. raised $8.5M
Hiya, Inc., a telecommunications company based in Seattle, WA, raised $8.5M in a new debt round, according to a filing dated 3 May 2021.
Raises filed before 2025 are not checked for a public announcement.
- Filed
- 3 May 2021
- Round
- Debt round
- Amount sold
- $8.5M
- Offering size
- $8.5M
- Investors so far
- 10
- Based in
- Seattle, WA
Investors on the board
Firms come from the venture funds whose filings name a director of this company.
Who is on the board
3 directors of this company are named on venture funds' filings. Sign in free with Google to see who, the full filing, and a short list of rounds like this each morning.
Sign in with GoogleHow it compares
Larger than 44% of the 2,220 tracked raises with an amount filed in 2021.
Hiya, Inc. in public filings
| Filed | Filing | Sold | Raise |
|---|---|---|---|
| 28 Mar 2023 | New filing | $4.7M | Another raise |
| 3 May 2021 | New filing | $8.5M | This raise |
| 20 Oct 2017 | New filing | $17.5M | Another raise |
More with Pioneer Square Ventures on the board
Other unannounced rounds
- DVx Atomic Co.$18.5M
- Aperio Systems, Inc.$1.6M
- Twin Health, Inc.$59M
- Scoring Factory AI Inc.$500K
- Royal & Pelham, Inc.$5.4M
- SPECTRA Holdings US, Ltd.$2.5M
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