Filed before 2025Filed 8 December 2015
LeafLink, Inc. raised $825K
LeafLink, Inc., a technology company based in New York, NY, raised $825K in a new debt round, according to a filing dated 8 December 2015.
Raises filed before 2025 are not checked for a public announcement.
- Filed
- 8 December 2015
- Round
- Debt round
- Amount sold
- $825K
- Offering size
- $1.25M
- Investors so far
- 17
- Based in
- New York, NY
Investors on the board
Firms come from the venture funds whose filings name a director of this company.
Who is on the board
1 director of this company is named on venture funds' filings. Sign in free with Google to see who, the full filing, and a short list of rounds like this each morning.
Sign in with GoogleHow it compares
Larger than 12% of the 1,574 tracked raises with an amount filed in 2015, and than 10% of the 787 in technology.
LeafLink, Inc. in public filings
| Filed | Filing | Sold | Raise |
|---|---|---|---|
| 29 Jun 2021 | New filing | $39.8M | Another raise |
| 17 Dec 2020 | New filing | $40.4M | Another raise |
| 8 Dec 2015 | New filing | $825K | This raise |
More with TIA Ventures on the board
- Ichor Vascular Inc.$2.92M
Other unannounced rounds
- DVx Atomic Co.$18.5M
- Aperio Systems, Inc.$1.6M
- Twin Health, Inc.$59M
- Scoring Factory AI Inc.$500K
- Royal & Pelham, Inc.$5.4M
- SPECTRA Holdings US, Ltd.$2.5M
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