UnannouncedVCCompany

Filed before 2025Latest filing 29 June 2021

LeafLink, Inc.

LeafLink, Inc. is a New York, NY technology company with 3 venture-backed raises in public filings, $81.1M sold in all. The latest was filed on 29 June 2021.

Raises filed before 2025 are not checked for a public announcement.

Watch LeafLink, Inc.

Raises

  1. Equity round$39.8MFiled before 202529 Jun 2021 · New York, NY
  2. Equity round$40.4MFiled before 202517 Dec 2020 · New York, NY
  3. Debt round$825KFiled before 20258 Dec 2015 · New York, NY

Investors on the board

Know when LeafLink, Inc. announces

Watch the company and get an email when it files a new raise or its round is announced. Free with Google.

Watch LeafLink, Inc.